⟩ Why should our small firm hire you as Logo Designer?
I genuinely love to collaborate, learn, and design. I strive for perfection in everything I do to ensure that each project I create is done to best of my abilities.
I genuinely love to collaborate, learn, and design. I strive for perfection in everything I do to ensure that each project I create is done to best of my abilities.
The mechanical properties of a good product material are a) strength b) toughness c) ductility d) all of the mentioned
Which among the below mentioned packages does not belong to the category of 'Small Outline Package'? a. SO b. SOP c. SOT d. SON
High current circuits are purposely located or placed near the edge of PCB in accordance to the supply lines for ________ a. Removal of heat b. Isolation of stray current c. Reduction of path length d. All of the above
Properties of workpiece materials are a) geometric features of the part b) production rate and quantity c) process selection consideration d) all of the mentioned
The expected qualities of a product are a) it satisfies the needs and expectations of the customer b) it has a pleasing appearance and handles well c) it has high reliability and functions safely over its intended life d) all of the mentioned
Which among the below mentioned approaches belongs to the category of In-circuit Testing? a. Impedance Testing b. Component Testing c. Apply Signal and check output d. All of the above
Considerations of costing systems are a) life cycle costs b) machine usage c) cost of purchasing machinery d) all of the mentioned
The life cycle of a product includes a. extraction of natural resources b. processing of raw materials c. manufacturing of products d) all of the mentioned
Sustainable manufacturing is required for a) conserving resources b) proper maintenance c) reuse d) all of the mentioned
Which type of solderability testing is carried out for the generation of solder sample due to immersion of wire or sheet metal specimen in a bath of molten solder? a. Solder Bath Testing b. Meniscus Rise Testing c. Solder Iron Testing d. None of the above